As millimeter wave RF device applications increase in the global communications, automotive and mil/Aero markets and expand above traditional millimeter wave frequency bands, the onus of limiting the signal parasitics associated with interconnects has never been more important. Techniques such as copper bumps and 3DIC packaging introduce complications and costs to designers that wire bonds do not. However, as the frequency climbs, the limitations of traditional wire or wedge bonding techniques become a real problem for package designers. Printed 3D Interconnects made with Aerosol Jet® printing provide package designers and RF engineers a new tool for optimizing interconnect transitions to active die, tailoring the loss characteristics to the application need and eliminating the need to compensate for high signal through and return loss. Printed 3D interconnects are digitally designed into the package and can be made of noble metals like gold, with the ability to create high conductivity traces. As they are conformal to the surface of the package, the trace length can be minimized, lowering inductance to active die circuitry specifically for die on board, die in trench, or die on die with pads-up packaging configurations. We will share examples showcasing similar loss performance to continuous transmission lines, significantly improving the performance when compared to bond wires and ribbons.
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